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Nanotechnologies and microsystems

Hermetically sealed thin-profile MEMS

Research content

Silicon devices and microelectromechanical systems (MEMS) are fabricated in a productive pilot line. Devices are packaged at the wafer level or chip scale into functional microsystems. Multi-disciplinary smart system integration based on ceramic or polymer System-in-Package is also offered.

Applications

VTT fabricates a wide selection of sensors, actuators, RF, fluidic, and photonic microsystems. The applications include environmental sensing, electronic timing, X-ray detection, telecommunication, and biomonitoring.

Future prospects

Various nanoelectronics technologies are effectively used to nurture classical microsystems. Atomic layer deposition, nanoimprinting, and electron beam technologies are used to produce modern nanostructured materials for practical nanosystems. The increasing need for embedded sensing, monitoring and control requires new structural integration technologies for functionalities in both low-cost and harsh environment applications.

Resources

VTT has two major cleanroom facilities for fabricating nanoelectronic devices and Microsystems, at Micronova in Espoo and Micromodule Centre in Oulu. The former is an extensive wafer fab where silicon and glass wafers are processed into devices; the latter concentrates on system integration.

Crystalline silica opal interposed between two ridge waveguides on a photonic chip


Additional information

Philippe Monnoyer
Head of Research Area
+358 20 722 4395

Juha Palve
Vice President, Customer Solutions
+358 20 722 2084

Harri Kopola
Vice President, Research, Knowledge intensive products and services
+358 20 722 2369

Competences

Additional information

Philippe Monnoyer
Head of Research Area
+358 20 722 4395

Juha Palve
Vice President, Customer Solutions
+358 20 722 2084

Harri Kopola
Vice President, Research, Knowledge intensive products and services
+358 20 722 2369

See also