Nanotechnologies and microsystems

Hermetically sealed thin-profile MEMS
Research content
Silicon devices and microelectromechanical systems (MEMS) are fabricated in a productive pilot line. Devices are packaged at the wafer level or chip scale into functional microsystems. Multi-disciplinary smart system integration based on ceramic or polymer System-in-Package is also offered.
Applications
VTT fabricates a wide selection of sensors, actuators, RF, fluidic, and photonic microsystems. The applications include environmental sensing, electronic timing, X-ray detection, telecommunication, and biomonitoring.
Future prospects
Various nanoelectronics technologies are effectively used to nurture classical microsystems. Atomic layer deposition, nanoimprinting, and electron beam technologies are used to produce modern nanostructured materials for practical nanosystems. The increasing need for embedded sensing, monitoring and control requires new structural integration technologies for functionalities in both low-cost and harsh environment applications.
Resources
VTT has two major cleanroom facilities for fabricating nanoelectronic devices and Microsystems, at Micronova in Espoo and Micromodule Centre in Oulu. The former is an extensive wafer fab where silicon and glass wafers are processed into devices; the latter concentrates on system integration.

Crystalline silica opal interposed between two ridge waveguides on a photonic chip
Additional information
Philippe Monnoyer
Technology Manager
+358 20 722 4395
Juha Palve
Vice President, Business Solutions
+358 20 722 2084
Harri Kopola
Vice President, Strategic Research
+358 20 722 2369

