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Micro and millimetre wave circuits and modules

Competence

VTT is a forerunner in developing and applying novel tuneable and reconfigurable microwave and millimetre wave circuits and modules to various applications. We have long experience in the development of technologies, components, circuits and sub-system modules from handset to sub-millimetre wave systems. We have several in-house technologies including Integrated Passive Devices (IPD), ferroelectric varactors, Bulk Acoustic Wave (BAW) resonators, RF MicroElectroMechanical Systems (MEMS) and Low Temperature Co-Fired Ceramics (LTCC). We are applying these technologies ourselves and also offering them for external users as customer specific or Multi-Project Wafer (MPW) runs. VTT is also leading the millimetre wave laboratory of Finland - MilliLab, which is European Space Agency's (ESA) external laboratory on millimetre waves.

VTT is collaborating with many key organisations in Europe and US in the field of micro- and millimetre wave microsystem modules.

Challenges

Modern multi-mode handsets have several radios which makes antenna and radio development challenging. Adaptive RF technologies are seen as a potential way to improve the performance of radios as well as allow greater functionality. Also, increased demand for higher data rates in wireless consumer products requires wider operation bands and frequencies. Available frequency bands at millimetre waves and rapid technology development in silicon technologies have increased interest towards millimetre wave systems.

Solutions

  • Adaptive antenna solutions from handsets to millimetre wave frequencies
  • Very low noise amplifiers and receivers
  • Millimetre wave identification (MMID)
  • Reconfigurable circuits and sub-systems based on novel technologies such as ferroelectric varactors and MEMS
  • Mm-wave circuits based on several technologies including CMOS, GaAs, InP, SiGe, RF MEMS
  • Customer specific and MPW fabrication services in in-house IPD, ferroelectric varactors, BAW, RF MEMS and LTCC system-on-package technologies
  • Millimetre wave on-wafer measurements up to 220 GHz (MilliLab)

Benefits

  • Frequency agile and adaptive radios with wide frequency coverage and good linearity
  • Compact System-in-Package (SIP) modules
  • Low cost fabrication techniques for high performance components (IPD, ferroelectric varactors, RF MEMS)

References and merits

  • Tailored antenna solutions to handset products
  • Development of 70 GHz receivers to the Planck surveyor
  • Numerous scientific publications related to technology development, components, antennas, MMICs, reconfigurable RF MEMS circuits, microwave and mm-wave modules
  • Central role in many European-level projects including ADOSE, AMICOM, MEMS-4-MMIC, MEMSPACK, RF-PLATFORM, etc.


Additional information

Tauno Vähä-Heikkilä
Research Coordinator, Research Team Leader
+358 20 722 7219

Markku Jenu
Key Account Manager
+358 20 722 6515