Module level packaging technology
Polymer-integration by assembled foil overmoulding
The VTT Micromodule Centre has expertise and facilities in electronics and optics design and manufacturing. Our competence covers advanced packaging, integration, interconnection and sealing techniques based on ceramic (especially LTCC) and polymer multilayer circuits, modules and smart system structural integration for photonic, sensor and communication applications.
Future Smart System packaging and integration key drivers are: a) technology convergence driven by applications, b) sensing and wireless connection: anywhere and anytime, c) electronics miniaturization by heterogeneous integration, d) the need for new cost-efficient manufacturing methods and material combinations.
VTT offers packaging and integration solutions with development, modelling, design and fabrication capabilities for multi-disciplinary (optics, mechanics, electronics, MEMS, fluidics and RF/millimetre wave) functional modules and systems for photonics, wireless communication and sensor applications.
Low temperature co-fired multi-layer ceramic (LTCC)-based high-performance,
miniaturised harsh environment System-on-Package solutions
Polymer-based integration with multi-layer foil printing, lamination, assembly
and over-moulding for optical user interfaces, displays, illumination and
Lithographic processing for micro- & nanostructures and photonics devices
(e.g. nano-imprint and near-field holographic lithography)
Precision flip chip & die bonding for thin and flexible printed/hybrid systems
Hermetically sealed nanopositioned fibre optics devices
Reliability assurance by thermal and thermomechanical simulation,
environmental testing and device characterisation.
The ceramic 3D LTCC high-performance system-on-package offers excellent thermal management, a small footprint, multi-disciplinary integration, high reliability and high-accuracy fibre alignment.
Polymer-based 3D structural integration offers
low-cost, high-throughput manufacturing capability, simpler value chain
3D design freedom and the convergence of embedded functionalities with
enhanced performance in systems
Flexible, light, thin, large-area and conformal structures
References and merits
Sensor integration development for Oras Electra water tap
SpaceFibre Fibre Optic Data Link for satellite communication
technology for a glucose sensor
Fiber-optic transceiver for 1 ... 3 Gbps intra-satellite optical data communications