List of main publications:

T. Hirvikorpi, M. Vähä-Nissi, T. Mustonen, E. Iiskola, M. Karppinen, Atomic Layer Deposited Aluminum Oxide Barrier Coatings for Packaging Materials,Thin Solid Films, 518 (2010) 2654.

T. Hirvikorpi, M. Vähä-Nissi, A. Harlin, M. Karppinen, Comparison of some coating techniques to fabricate barrier layers on packaging materials, Thin Solid Films, 518 (2010) 5463.

T. Hirvikorpi, M. Vähä-Nissi, A. Harlin, J. Marles, V. Miikkulainen, M. Karppinen, Effect of corona pre-treatment on the performance of gas barrier layers applied by atomic layer deposition onto polymer-coated paperboard, Appl. Surf. Sci., 257 (2010) 736–740.

T. Hirvikorpi, M. Vähä-Nissi, A. Harlin, M. Salomäki, J. Kankare, S. Areva, J.T. Korhonen, M. Karppinen, Barrier properties of multilayered polyelectrolyte complexes coated with atomic layer deposited Al2O3 layer, Appl. Surf. Sci., submitted (2010).

T. Hirvikorpi, M. Vähä-Nissi, J. Vartiainen, P. Penttilä, J. Nikkola, A. Harlin, R. Serimaa, M. Karppinen, Effect of heat-treatment on the performance of gas barrier layers applied by atomic layer deposition onto polymer-coated paperboard, J Appl. Polymer Sci., submitted (2010).

T. Hirvikorpi, M. Vähä-Nissi, A. Harlin, M. Karppinen, Atomic layer deposition as a means to fabricate thin barrier layers on packaging materials, ECNF 2010. Liege, Belgium. 22-25 March 2010.

T. Hirvikorpi, M. Vähä-Nissi, T. Mustonen, A. Harlin, Thin Inorganic Barrier Coatings for Packaging Materials, TAPPI 2010 PLACE Conference. Albuquerque, NM. 19-21 Apr 2010.

T. Hirvikorpi, M. Vähä-Nissi, A. Harlin, M. Karppinen, Atomic layer deposition as a means to fabricate thin barrier layers on packaging materials, NPD 2010. Helsinki, Finland. 24-26 May 2010

M. Vähä-Nissi, T. Hirvikorpi, T. Mustonen, M. Karppinen, A. Harlin Thin film deposition techniques – steps towards more sustainable packages, 2010 TAPPI Intl Conf on Nano for the Forest Product Industry. Espoo, Finland. 27-29 September 2010

T. Kääriäinen, P. Maydannik, M-L Kääriäinen, D.Cameron, P. Johansson , K. Lahtinen, J. Kuusipalo, Continuous Atomic Layer Deposition Process, 15th Technology Summit & Technology Platform. New Delhi, India. 26-27 Nov, 2009.

P. Maydannik, T. Kääriäinen, D.Cameron, A continuous ALD process for deposition on flexible substrates, SVC 53rd Annual Technical Conference. Orlando, FL. 19-22 Apr 2010.

T. Kääriäinen, D. Cameron D, K. Lahtinen, P. Johansson, J. Kuusipalo , Atomic Layer Deposition of Metal Oxide Films as Diffusion Barriers on Flexible Packaging Materials, SVC 53rd Annual Technical Conference. Orlando, FL. 19-22 Apr 2010.

P. Johansson, K. Lahtinen, J. Kuusipalo, T. Kääriäinen, P. Maydannik, D. Cameron, Atomic layer deposition process for barrier applications of flexible packaging, TAPPI 2010 PLACE Conference. Albuquerque, NM. 19-21 Apr 2010.

P. Maydannik, T. Kääriäinen, D.Cameron, A continuous ALD process for deposition on flexible substrates, AVS 10th International Conference on Atomic Layer Deposition. Seoul, South-Korea. 20-23 June 2010.

P. Maydannik, T. Kääriäinen, D.Cameron, M Putkonen, Continuous Atomic Layer Deposition process: towards roll-to-roll ALD, AVS 10th International Conference on Atomic Layer Deposition. Seoul, South-Korea. 20-23 June 2010.

D. Cameron, P. Maydannik, T.Kääriäinen, Continuous and roll-to-roll atomic layer deposition, Baltic ALD and German ALD Conference. Hamburg, Germany. 16-17 Sep 2010.